Electrospun alimentary protein scaffolds for tissue engineering

Leko Lin, Devika Varma, Anat Perets, Mengyan Li, Dara L. Woerdeman, Peter I. Lelkes

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We have shown that submicron sized fibers can be successfully electrospun from SPI/PEO and zein solutions, and that both scaffolds support normal cell growth comparable to or better than controls. Current work involves characterization of the mechanical properties of both scaffolds and more detailed adhesion and migration assays of cells on and into the fibers.

Original languageEnglish
Title of host publication8th World Biomaterials Congress 2008
Pages241
Number of pages1
StatePublished - 2008
Externally publishedYes
Event8th World Biomaterials Congress 2008, WBC 2008 - Amsterdam, Netherlands
Duration: May 28 2008Jun 1 2008

Publication series

Name8th World Biomaterials Congress 2008
Volume1

Conference

Conference8th World Biomaterials Congress 2008, WBC 2008
Country/TerritoryNetherlands
CityAmsterdam
Period05/28/0806/1/08

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